CRC Press
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Product Code:
9780367635886
ISBN13:
9780367635886
Condition:
New
$76.11
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
| Author: Ephraim Suhir |
| Publisher: CRC Press |
| Publication Date: Oct 04, 2024 |
| Number of Pages: NA pages |
| Language: English |
| Binding: Paperback |
| ISBN-10: 0367635887 |
| ISBN-13: 9780367635886 |
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
$76.11
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
| Author: Ephraim Suhir |
| Publisher: CRC Press |
| Publication Date: Oct 04, 2024 |
| Number of Pages: NA pages |
| Language: English |
| Binding: Paperback |
| ISBN-10: 0367635887 |
| ISBN-13: 9780367635886 |
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