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Springer
Silicon Components and Processes Self Study : Unit Processes and Process Integration
Product Code:
9783031592188
ISBN13:
9783031592188
Condition:
New
$117.02
This book is one of a series of five volumes forming an integrated, self-study course on silicon device physics, modes of operation, characterization, and fabrication. The series is based on many years of the author?s experience in academic and industrial teaching of semiconductors. The books are suitable for both class-teaching and self-study. The authors have designed the content to enable readers to be introduced gradually to semiconductors, in particular silicon components. The presentation includes many illustrations, practical examples, review questions and problems at the end of each chapter. Answers to review questions and solutions to problems will be provided for ?self-check?.
Author: Badih El-Kareh, Lou N. Hutter |
Publisher: Springer |
Publication Date: Aug 22, 2024 |
Number of Pages: NA pages |
Language: English |
Binding: Hardcover |
ISBN-10: 3031592182 |
ISBN-13: 9783031592188 |
![](https://cdn11.bigcommerce.com/s-lfa8nfd02s/images/stencil/100x100/products/552183/509316/9783031592188__92536.1732199619.jpg?c=1)
Silicon Components and Processes Self Study : Unit Processes and Process Integration
$117.02
This book is one of a series of five volumes forming an integrated, self-study course on silicon device physics, modes of operation, characterization, and fabrication. The series is based on many years of the author?s experience in academic and industrial teaching of semiconductors. The books are suitable for both class-teaching and self-study. The authors have designed the content to enable readers to be introduced gradually to semiconductors, in particular silicon components. The presentation includes many illustrations, practical examples, review questions and problems at the end of each chapter. Answers to review questions and solutions to problems will be provided for ?self-check?.
Author: Badih El-Kareh, Lou N. Hutter |
Publisher: Springer |
Publication Date: Aug 22, 2024 |
Number of Pages: NA pages |
Language: English |
Binding: Hardcover |
ISBN-10: 3031592182 |
ISBN-13: 9783031592188 |