Springer
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Product Code:
9783319204802
ISBN13:
9783319204802
Condition:
New
$61.47
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
$61.47
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
| Author: Elfadel |
| Publisher: Springer |
| Publication Date: May 23, 2016 |
| Number of Pages: 339 pages |
| Binding: Hardback or Cased Book |
| ISBN-10: 3319204807 |
| ISBN-13: 9783319204802 |
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