MDPI AG
Simulation and Reliability Assessment of Advanced Packaging
Product Code:
9783725809721
ISBN13:
9783725809721
Condition:
New
$96.85
$85.91
Sale 11%
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.
| Author: Kuo-Ning Chiang |
| Publisher: MDPI AG |
| Publication Date: Apr 30, 2024 |
| Number of Pages: NA pages |
| Language: English |
| Binding: Hardcover |
| ISBN-10: 3725809720 |
| ISBN-13: 9783725809721 |
Simulation and Reliability Assessment of Advanced Packaging
$96.85
$85.91
Sale 11%
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.
| Author: Kuo-Ning Chiang |
| Publisher: MDPI AG |
| Publication Date: Apr 30, 2024 |
| Number of Pages: NA pages |
| Language: English |
| Binding: Hardcover |
| ISBN-10: 3725809720 |
| ISBN-13: 9783725809721 |
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