Springer
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Product Code:
9789811061646
ISBN13:
9789811061646
Condition:
New
$117.02
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
$117.02
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
| Author: Jie Cheng |
| Publisher: Springer |
| Publication Date: Sep 18, 2017 |
| Number of Pages: 137 pages |
| Language: English |
| Binding: Hardcover |
| ISBN-10: 9811061645 |
| ISBN-13: 9789811061646 |
Related Products
Sale 3%
