Springer
Modeling and Application of Flexible Electronics Packaging
Product Code:
9789811336263
ISBN13:
9789811336263
Condition:
New
$117.02
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
| Author: YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Publisher: Springer |
| Publication Date: May 07, 2019 |
| Number of Pages: 286 pages |
| Language: English |
| Binding: Hardcover |
| ISBN-10: 9811336261 |
| ISBN-13: 9789811336263 |
Modeling and Application of Flexible Electronics Packaging
$117.02
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
| Author: YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Publisher: Springer |
| Publication Date: May 07, 2019 |
| Number of Pages: 286 pages |
| Language: English |
| Binding: Hardcover |
| ISBN-10: 9811336261 |
| ISBN-13: 9789811336263 |
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